Nexelia™ for Electronics Manufacturing

As lead-free soldering becomes the global standard, the electronics manufacturing industry is looking for a more efficient cooling system within the soldering processes. This is due to the fact that:

• The process temperature is much higher with lead-free solders.
• Improved thermal insulation in the soldering equipment generates higher heat.
• The reflow ovens’ length is already maxed out and cannot continue to be expanded.

In addition, the industry continues to require increased energy savings and reduction in carbon dioxide emissions.

A comprehensive gas solution designed for and adapted to your specific needs, Nexelia™ for Electronics Manufacturing  combines the best of our gases, application technologies and expert support. As with all solutions under the Nexelia^TM label, we work closely with you to pre-define a concrete set of results, and we commit to delivering them.

A real-time automatic solution, Nexelia™ for Cooling Systems works by recycling the cold generated by liquid nitrogen vaporization back into the cooling system.

A complete retrofit solution, Nexelia™ for Reflow Soldering was expertly designed by Air Liquide to generate and carefully monitor inert atmosphere into the reflow oven. The solution combines nitrogen supply with an automated controlling system to automatically adjust the inert atmosphere composition in the reflow oven.

A total retrofit solution to generate and carefully maintain an inert atmosphere during the wave-soldering process.